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i2a Technologies is engaged principally in the development and assembly activities related to QFP, BGA, fpBGA, CSP, SIP, QFN / DFN, Wafer bumping, WLCSP, COC (chip on chip) and multi-chip packaging technology, using both wire-bonding as well as flip-chip interconnect technologies. We provide…
Finance: Commercial Banking, Lending, Underwriting
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